Negotiable
The date of payment from buyers deliver within days
Guangdong
Long-term effective
2017-08-08 18:07
453
Company Profile
By certification [File Integrity]
Contact: xinjingfu(Mr.)
Email:
Telephone:
Phone:
Area: Guangdong
address: Longyuan Industry Park, Mapi Town,
Website: http://www.welltechpcb.com/ http://xinjingfu.gztaixiangzghy.com/
Stainless Steel Flowmeter Manifold
unit price:Negotiable
Brass Electroplated Manifold
unit price:Negotiable
Ball Valve Manifold
unit price:Negotiable
Stainless Steel Bamboo-joint Type Manifold
unit price:Negotiable
Brass-colored Manifold
unit price:Negotiable
15kw Laser Air Compressor
unit price:Negotiable
Welcome to Well-Tech - one of the leading manufacturers and suppliers of PCB products in China. Our factory is engaged in PCB manufacturing and offering customized top quality mutilayer hdi printed circuit board with 0.6mm board thickness and 3mil trace width 3mil gap. at competitive price. High reliability, strong diversity and expert advice are our characteristics. Please contact us if you have inquiry.
Products description:
HDI PCB: HDI (High Density Interconnector) PCB has smaller holes (≤0.15mm) in BGA or copper pad which will using laser drilling, and most of HDI PCB has intersect blind and buried vias. HDI technology becomes more and more popular for the field of mobile phone, PC, automotive electronics and other digital products.
Products specification:
Layers: 4
Material /Laminate: IT180A (TG180)
Board thickness: 0.6mm
Minimum trace width/gap: 3/3mil
Minimum hole: 0.1mm
Copper weight: inner & outer 0.5oz
Finishing: ENIG
BGA design rules
1)The minimum BGA ball should be above 10mil for HASL and HASL lead free surface finish.
2)Min 9mil size BGA ball for Immersion Gold.
3)For minimum via(Except 0.15mm), the PCB thickness/minimum hole size that the aspect ratio should be ≤10.
4)The size of 0.15mm via holes only be drilled for finished thickness board ≤1.2mm.
2L- Hoz |
4L- Hoz |
6L- Hoz |
8L- Hoz |
10L- Hoz |
|
minimum BGA ball |
10mil |
10mil |
10mil |
10mil |
10mil |
BGA pad to trace |
4mil (3mil min. Finished 1oz CU) |
4mil (3mil min. Finished 1oz CU) |
4mil (3mil min. Finished 1oz CU) |
4mil (3mil min. Finished 1oz CU) |
4mil (3mil min. Finished 1oz CU) |
pad to pad |
4mil (3mil min. Finished 1oz CU) |
4mil (3mil min. Finished 1oz CU) |
4mil (3mil min. Finished 1oz CU) |
4mil (3mil min. Finished 1oz CU) |
4mil (3mil min. Finished 1oz CU) |
minimum via |
0.15mm |
0.15mm |
0.15mm |
0.15mm |
0.15mm |
via to trace |
6mil |
8mil |
8mil |
8mil |
8mil |